Program contact: Questions should be directed to: firstname.lastname@example.org
Detroit Public Schools will hold a Bond Program Industry Opportunity Fair, an information session designed to alert the design and construction community of Bond Program opportunities, communicate procurement procedures and goals, and allow firms to network in preparation for pursuing opportunities.
The fair will be held Wednesday, February 24 from 8 a.m. to 12 p.m. at the Cobo Hall Riverview Ballroom.
Questions should be directed to a new e-mail address: email@example.com.
Robert Bobb, Detroit Public Schools’ Emergency Financial Manager, will host the event, targeted at firms in the design and construction industry.
The fair will include a review of the planned projects and implementation schedule for the district’s $500.5 million School Construction and Modernization Program; a review of the design-build procurement process, the bridging documents and general contract terms; a bidding presentation outlining bidding requirements and selection criteria, including participation goals; a review of certification requirements and procedures and direction for future assistance; and more.
The district also soon will hold a DPS Bond Program Opportunity Fair for Workers, an information session designed to provide information for individual workers interested in construction and other jobs that will be available under the Bond Program, share participation goals, and introduce job seekers to firms and job development agencies. The date is to be determined and will be announced shortly.
For more on the School Construction and Modernization Program and regular updates, go to http://www.detroit.k12.mi.us/proposal_s/facilities/